Micropackaging for the Next Generation of Optical and Electrical Components
(January 2007, 75 pages)
Examines optical packaging technology for next generation fiber optic components with an eye towards lower cost and higher volume.
OIDA members receive a free copy with their membership
OIDA News
March 14, 2008
Lebby to Speak at 4th Annual Executive Symposium on Photonics Commercialization
March 11, 2008
Solid State Lighting Webinar - Presentations posted
January 29, 2008
Perspectives on the Optoelectronics Industry Report
January 8, 2008
Two New OIDA Interest Groups


